Achilles Protos Carrier Z series

** Please contact us for pricing & details. Online orders will not be accepted.

 

Protos Carrier Z series

Achilles Wafer Package System, developed making good use of Achilles' plastics processing technologies (injection forming, film processing, urethane processing, conductive processing etc.) can transfer/transport your wafers both safely and efficiently.

Whenever you have troubles with transferring/transporting such highly fragile wafers as thin wafer for TSV chips and compound wafers, please contact us. We are ready to provide you with optimum solutions.

 

Part Number

Z200 (correspond to dicing frame for 8 inch wafer)
Z300 (correspond to dicing frame for 12 inch wafer)

Features

Compact design can reduce transportation costs.

One-push(snap-lock)allows easy packing of wafers

Control the vibration of wafer by movable wall.

Adoption of clean plastics reduces conatamination on wafer surfaces.

Use in combination with ring spacers makes noncontact transportation of wafers possible.

Z300 is provided with Kinematic Coupling that allows wafers to be readily alligned with transfer equipment.

Surface resistance

< 1.0×105Ω

Material

Conductive PP

 

Specification

Part Number

Wafer Diameter

Container Height

(mm)

Effective Height
h (mm)

Effective diameter

(mm)

Container diameter

(mm)

Z200

8 inch with frame

69

31

201.5

225.8

Z300

12 inch with frame

82.7

44

301.8

326

 

 

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