** Please contact us for pricing & details. Online orders will not be accepted.
Protos Carrier ND series
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Part Number
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ND-6 (correspond to dicing frame for 6 inch wafer)
ND-8 (correspond to dicing frame for 8 inch wafer)
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Feature
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Simplify the packing of diced wafer on frame to increase work efficiency.
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Diced wafer on frame can be stacked up to 13 pieces.
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With stopper for dicing frame
(It varies by the kind of frame)
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Cushioning material and spacer correspond to diced wafer on frame (6 inch and 8 inch) are available.
Please ask for more information.
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Surface Resistivity
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< 1.0×106Ω
|
|
Material
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Conductive Polypropylene
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Specification
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Part Number
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Wafer Diameter
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H(mm)
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h(mm)
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D(mm)
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A(mm)
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ND-6
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6 inch with frame
|
83
|
40
|
230±1
|
252
|
|
ND-8
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8 inch with frame
|
92
|
57
|
299±1
|
322
|
|
ND-12
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12 inch with frame
|
74
|
45
|
403±1
|
430
|
Wafer Case for single piece of wafer
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Part Number
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VFP-ND-6R-60(for 6inch wafer with frame)
VFP-ND-8R-90(for 8inch wafer with frame)
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Feature
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Single piece of wafer with frame can be transferred/transported.
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As frame is used for fixing,there is no contact with wafer.
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Using clean conductive material(ST-Poly)
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Optimum for transporting test production wafers
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Surface Resistance
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< 1.0×107Ω
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Material
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Conductive A-PET
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