** Please contact us for pricing & details. Online orders will not be accepted.
Protos Carrier Z series
Achilles Wafer Package System, developed making good use of Achilles' plastics processing technologies (injection forming, film processing, urethane processing, conductive processing etc.) can transfer/transport your wafers both safely and efficiently.
Whenever you have troubles with transferring/transporting such highly fragile wafers as thin wafer for TSV chips and compound wafers, please contact us. We are ready to provide you with optimum solutions.
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Part Number
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Z200 (correspond to dicing frame for 8 inch wafer)
Z300 (correspond to dicing frame for 12 inch wafer)
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Features
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Compact design can reduce transportation costs.
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One-push(snap-lock)allows easy packing of wafers
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Control the vibration of wafer by movable wall.
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Adoption of clean plastics reduces conatamination on wafer surfaces.
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Use in combination with ring spacers makes noncontact transportation of wafers possible.
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Z300 is provided with Kinematic Coupling that allows wafers to be readily alligned with transfer equipment.
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Surface resistance
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< 1.0×105Ω
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Material
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Conductive PP
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Specification
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Part Number
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Wafer Diameter
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Container Height
(mm)
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Effective Height
h (mm)
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Effective diameter
(mm)
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Container diameter
(mm)
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Z200
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8 inch with frame
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69
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31
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201.5
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225.8
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Z300
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12 inch with frame
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82.7
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44
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301.8
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326
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