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Protos Carrier Z series
Achilles Wafer Package System, developed making good use of Achilles' plastics processing technologies (injection forming, film processing, urethane processing, conductive processing etc.) can transfer/transport your wafers both safely and efficiently.
Whenever you have troubles with transferring/transporting such highly fragile wafers as thin wafer for TSV chips and compound wafers, please contact us. We are ready to provide you with optimum solutions.
Part Number |
Z200 (correspond to dicing frame for 8 inch wafer) |
Features |
Compact design can reduce transportation costs. |
One-push(snap-lock)allows easy packing of wafers |
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Control the vibration of wafer by movable wall. |
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Adoption of clean plastics reduces conatamination on wafer surfaces. |
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Use in combination with ring spacers makes noncontact transportation of wafers possible. |
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Z300 is provided with Kinematic Coupling that allows wafers to be readily alligned with transfer equipment. |
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Surface resistance |
< 1.0×105Ω |
Material |
Conductive PP |
Specification
Part Number |
Wafer Diameter |
Container Height (mm) |
Effective Height |
Effective diameter (mm) |
Container diameter (mm) |
Z200 |
8 inch with frame |
69 |
31 |
201.5 |
225.8 |
Z300 |
12 inch with frame |
82.7 |
44 |
301.8 |
326 |